Wafers, the very core of the solar cells, are manufactured by slicing ingots into thin plates. Currently, wafers that are 170 to 200 micrometers thick are the most common. However, these wafers are extremely fragile and tend to break easily; therefore fabrication and handling processes require extreme caution. Sliced wafers go through the process of cleansing/drying, and strict visual and mechanical inspections are conducted before they are shipped to customers.

・Monocrystalline silicon solar wafers
・Conductivity type: N type/ P type
・Dummy / Mechanical dummy / Test dummy

Our offerings

Monocrystalline silicon solar wafers (Conductivity type: N type /P type)

Manufactured ingots are processed into wafers at the Nagano Works. These wafers are supplied to leading cell manufacturers both in Japan and abroad. The mass production technology for 170-micrometer thin wafers has already been established, and we are now working on boosting yield and minimizing the consumption of silicon materials.
The wafers come in sizes of 104 mm × 104 mm, 125 mm × 125 mm, and 156 mm × 156 mm.

Technical data

Monocrystalline silicon solar wafers